
Article 1 
The Annex to Directive 2002/95/EC is amended as set out in the Annex to this Decision.
Article 2 
This Decision is addressed to the Member States.
Done at Brussels, 21 October 2005.
For the Commission
Stavros DIMAS
Member of the Commission
ANNEX

Annex to Directive 2002/95/EC is amended as follows:

1.. point 7 is replaced by the following:
'
7.. 
— Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead),
— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications,
— lead in electronic ceramic parts (e.g. piezoelectronic devices).';
2.. point 8 is replaced by the following:
'
8.. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations.';
3.. the following points are added:
'
11.. Lead used in compliant pin connector systems.
12.. Lead as a coating material for the thermal conduction module c-ring.
13.. Lead and cadmium in optical and filter glass.
14.. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight.
15.. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.'
